The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 29, 2017
Filed:
Dec. 15, 2011
Deokkyung Yang, Hanam-si, KR;
IN Sang Yoon, Ichon-si, KR;
Seonghun Mun, Incheon, KR;
Kyunghwan Kim, Seoul, KR;
DeokKyung Yang, Hanam-si, KR;
In Sang Yoon, Ichon-si, KR;
SeongHun Mun, Incheon, KR;
KyungHwan Kim, Seoul, KR;
STATS ChipPAC Pte. Ltd., Singapore, SG;
Abstract
A method of manufacture of an integrated circuit packaging system including: providing a package carrier; mounting an integrated circuit to the package carrier; mounting a circuit interposer above the integrated circuit; mounting a mounting integrated circuit above the circuit interposer; forming a conductive pillar to the circuit interposer adjacent to the mounting integrated circuit; connecting the circuit interposer to the package carrier; and forming an encapsulation on the package carrier.