Incheon, South Korea

SeongHun Mun


Average Co-Inventor Count = 3.4

ph-index = 3

Forward Citations = 42(Granted Patents)


Location History:

  • Gyeonggi-do, KR (2016)
  • Incheon, KR (2013 - 2017)
  • Bucheon-si, KR (2015 - 2018)

Company Filing History:


Years Active: 2013-2018

Loading Chart...
7 patents (USPTO):Explore Patents

Title: SeongHun Mun: Innovator in Semiconductor Packaging

Introduction

SeongHun Mun is a prominent inventor based in Incheon, South Korea. He has made significant contributions to the field of semiconductor packaging, holding a total of 7 patents. His innovative designs and methods have advanced the reliability and efficiency of integrated circuit systems.

Latest Patents

One of his latest patents focuses on interposer substrate designs for semiconductor packages. This invention addresses the issue of void formations during the molding process by incorporating cavities in the upper substrate. These cavities are strategically placed over integrated circuit devices, allowing for better flow of the molding compound and reducing the risk of defects. Additionally, the design includes extension members or recesses on the upper substrate's surface, which further minimizes the bleeding of the molding compound between adjacent packages, enhancing device reliability and yield.

Another notable patent by SeongHun Mun is for an integrated circuit packaging system with conductive pillars. This method involves several steps, including providing a package carrier, mounting an integrated circuit, and forming a conductive pillar adjacent to the mounting integrated circuit. This innovative approach not only improves the manufacturing process but also enhances the overall performance of the packaging system.

Career Highlights

SeongHun Mun is currently employed at Stats Chippac Pte. Ltd., where he continues to develop cutting-edge technologies in semiconductor packaging. His work has been instrumental in pushing the boundaries of what is possible in this field.

Collaborations

Throughout his career, SeongHun Mun has collaborated with talented individuals such as DeokKyung Yang and SeongMin Lee. These partnerships have fostered a creative environment that has led to numerous advancements in semiconductor technology.

Conclusion

SeongHun Mun's contributions to semiconductor packaging through his innovative patents and collaborative efforts have made a significant impact in the industry. His work continues to pave the way for future advancements in integrated circuit technology.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…