The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 19, 2013
Filed:
Mar. 25, 2010
Seongmin Lee, Seoul, KR;
Seonghun Mun, Incheon, KR;
Byung Joon Han, Singapore, SG;
STATS ChipPAC Ltd., Singapore, SG;
Abstract
A method of manufacture of an integrated circuit packaging system includes: fabricating a base package substrate having a component side and a system side; coupling a first integrated circuit die on the component side; coupling stacking interconnects on the component side around the first integrated circuit die; forming a package body on the component side, the first integrated circuit die, and the stacking interconnects; forming vertical insertion cavities through the package body and on the stacking interconnects; and forming a trench, in the package body, adjacent to the vertical insertion cavities for reducing a package warping stress.