The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 2015
Filed:
Mar. 15, 2014
Byung Tai DO, Singapore, SG;
Arnel Senosa Trasporto, Singapore, SG;
Sung Soo Kim, Seoul, KR;
Asri Yusof, Singapore, SG;
IN Sang Yoon, Seoul, KR;
Byung Tai Do, Singapore, SG;
Arnel Senosa Trasporto, Singapore, SG;
Sung Soo Kim, Seoul, KR;
Asri Yusof, Singapore, SG;
In Sang Yoon, Seoul, KR;
STATS ChipPAC Ltd., Singapore, SG;
Abstract
A system and method for manufacturing an integrated circuit packaging system includes: forming a base substrate including: providing a sacrificial carrier: mounting a metallic sheet on the sacrificial carrier, applying a top trace to the metallic sheet, forming a conductive stud on the top trace, forming a base encapsulation over the metallic sheet, the top trace, and the conductive stud, the top trace exposed from a top surface of the base encapsulation, and removing the sacrificial carrier and the metallic sheet; mounting an integrated circuit device on the base substrate; and encapsulating the integrated circuit device and the base substrate with a top encapsulation.