The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 04, 2014
Filed:
Sep. 28, 2006
Applicants:
Jong-woo Ha, Seoul, KR;
Bumjoon Hong, Seoul, KR;
Inventors:
Jong-Woo Ha, Seoul, KR;
BumJoon Hong, Seoul, KR;
Assignee:
Stats Chippac Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/11 (2006.01);
U.S. Cl.
CPC ...
Abstract
An integrated circuit package system that includes: providing an electrical interconnect system including a first lead-finger system and a second lead-finger system; connecting a first device to the first lead-finger system with a wire bond; stacking a second device over the first device; and connecting the second device to the second lead-finger system with a bump bond.