The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 24, 2015
Filed:
Nov. 19, 2008
Applicants:
Jong-woo Ha, Seoul, KR;
Sung Yoon Lee, Inchon-si, KR;
Taeg Ki Lim, Icheon, KR;
Inventors:
Assignee:
STATS ChipPAC Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 25/03 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3128 (2013.01); H01L 21/56 (2013.01); H01L 23/3135 (2013.01); H01L 23/49833 (2013.01); H01L 24/97 (2013.01); H01L 25/03 (2013.01); H01L 25/0657 (2013.01); H01L 24/48 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48225 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/97 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06562 (2013.01); H01L 2225/06568 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/1815 (2013.01); H01L 2924/19107 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48227 (2013.01);
Abstract
A method of manufacture of a semiconductor package system includes: attaching an internal stacking module die to a surface of an internal stacking module substrate having an internal stacking module bonding pad along an edge of an opposite surface thereof; and attaching a support carrier to support the internal stacking module substrate by two edges thereof with the internal stacking module bonding pad exposed.