Taeg Ki Lim

Title: Taeg Ki Lim: Innovator in Integrated Circuit Packaging

Introduction

Taeg Ki Lim is a prominent inventor based in Icheon, South Korea. He has made significant contributions to the field of semiconductor packaging, holding a total of 11 patents. His innovative work has advanced the technology used in integrated circuit systems, making him a key figure in the industry.

Latest Patents

Among his latest patents, Taeg Ki Lim has developed an "Integrated circuit package system with support carrier and method of manufacture thereof." This patent describes a method for manufacturing a semiconductor package system that involves attaching an internal stacking module die to a substrate and securing it with a support carrier. Another notable patent is the "Integrated circuit package system with offset stack," which details a system for mounting integrated circuit devices in an offset configuration, enhancing the efficiency of interconnects and encapsulation.

Career Highlights

Taeg Ki Lim is currently employed at Stats Chippac Pte. Ltd., where he continues to innovate in the semiconductor packaging domain. His work has not only contributed to the advancement of technology but has also positioned his company as a leader in the industry.

Collaborations

Throughout his career, Taeg Ki Lim has collaborated with talented individuals such as Jong Wook Ju and Hyun Joung Kim. These partnerships have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.

Conclusion

In summary, Taeg Ki Lim is a distinguished inventor whose work in integrated circuit packaging has led to numerous patents and advancements in the field. His contributions continue to shape the future of semiconductor technology.