The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 02, 2013
Filed:
Jul. 12, 2010
Heap Hoe Kuan, Singapore, SG;
Hamid Eslampour, San Jose, CA (US);
Daesik Choi, Seoul, KR;
Rui Huang, Singapore, SG;
Taeg Ki Lim, Icheon, KR;
Heap Hoe Kuan, Singapore, SG;
Hamid Eslampour, San Jose, CA (US);
DaeSik Choi, Seoul, KR;
Rui Huang, Singapore, SG;
Taeg Ki Lim, Icheon, KR;
Stats Chippac Ltd., Singapore, SG;
Abstract
A method of manufacture of an integrated circuit package system includes: providing a substrate with a top surface; configuring the top surface to include electrical contacts and an integrated circuit; providing a structure over the substrate with only a honeycomb meshwork of posts contacting the top surface of the substrate; and depositing a material to prevent warpage of the substrate on the top surface of the substrate and over the integrated circuit, the material patterned to have discrete hollow conduits that expose the electrical contacts.