Inchon-si, South Korea

Sung Yoon Lee


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2010-2015

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2 patents (USPTO):Explore Patents

Title: The Innovations of Sung Yoon Lee: A Pioneer in Integrated Circuit Technology

Introduction: Sung Yoon Lee, based in Inchon-si, South Korea, is a notable inventor with a focus on advancements in integrated circuit technology. His work has significantly contributed to the semiconductor industry, making him a recognized name within his field.

Latest Patents: Lee holds two patents that highlight his innovative contributions. The first patent is for an "Integrated circuit package system with support carrier and method of manufacture thereof." This invention involves a method for manufacturing a semiconductor package system whereby an internal stacking module die is attached to a surface of an internal stacking module substrate. The design includes a support carrier that stabilizes the substrate while exposing the bonding pad, showcasing a practical approach to circuit assembly.

His second patent, titled "Integrated circuit system with wafer trimming," describes a process for integrating a circuit wafer that includes forming a trimmed edge and applying a thinning process. This advancement addresses efficiency in wafer processing, which is crucial for enhancing the performance of integrated circuits.

Career Highlights: Sung Yoon Lee is affiliated with Stats Chippac Pte. Ltd., an innovative company in the semiconductor packaging industry. His contributions to integrated circuit packaging and processing have positioned him as a valuable asset to the organization and the broader technology sector.

Collaborations: Throughout his career, Lee has collaborated with fellow engineers and innovators, including Seung Wook Park and Taewoo Lee. These collaborations have fostered a creative environment leading to groundbreaking advancements in their respective fields.

Conclusion: Sung Yoon Lee’s expertise and patented inventions in integrated circuit technology reflect his dedication to innovation. As he continues his work at Stats Chippac Pte. Ltd., the impact of his contributions is expected to resonate throughout the semiconductor industry, inspiring future developments in technology.

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