Stats Chippac Pte. Ltd.

Sung Yoon Lee

Seung Wook Park

Jong-Woo Ha

Taewoo Lee

Taeg Ki Lim

A method of manufacture of a semiconductor package system includes: attaching an internal stacking module die to a surface of an internal stacking module substrate having an internal stacking module bonding pad along an edge of an opposite surface thereof; and attaching a support carrier to support the internal stacking module substrate by two edges thereof with the internal stacking module bonding pad exposed.

Integrated circuit package system with support carrier and method of manufacture thereof

An integrated circuit system includes an integrated circuit wafer, forming a trimmed edge on the integrated circuit wafer, and applying a thinning process on the integrated circuit wafer with the trimmed edge.

Growing community of inventors

Inchon-si, South Korea

Sung Yoon Lee