Soo Won Lee

Title: Soo Won Lee: Innovator in Integrated Circuit Packaging

Introduction

Soo Won Lee is a prominent inventor based in Yongin-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 5 patents. His work focuses on innovative solutions for integrated circuit packaging systems.

Latest Patents

One of his latest patents is an integrated circuit packaging system with a substrate and a method of manufacture thereof. This invention includes a substrate featuring a first trace layer and an encapsulation on the first trace layer. The first trace layer has a surface exposed from the encapsulation with a rough texture characteristic of the removal of a conductive carrier coating. Additionally, a second trace layer is placed on the encapsulation and over the first trace layer, connecting to it. An integrated circuit die is then attached to the substrate.

Another notable patent is for a semiconductor device and a method of forming a duplex plated bump-on-lead pad over a substrate for finer pitch between adjacent traces. This invention involves a substrate with a conductive layer formed over it. A duplex plated bump on lead pad is created over the substrate, along with an insulating layer. A portion of the insulating layer over the duplex plated bump on lead pad is removed using a laser direct ablation process. The semiconductor die mounted over the substrate features a composite conductive interconnect structure, with a pitch ranging from 90-150 micrometers between the first and second bumps.

Career Highlights

Soo Won Lee is currently employed at Stats Chippac Pte. Ltd., where he continues to innovate in the semiconductor industry. His work has been instrumental in advancing integrated circuit technologies.

Collaborations

He collaborates with talented individuals such as Jeffrey David Punzalan and Dao Nguyen Phu Cuong, who contribute to the innovative environment at Stats Chippac Pte. Ltd.

Conclusion

Soo Won Lee's contributions to integrated circuit packaging and semiconductor devices highlight his role as a key innovator in the field. His patents reflect a commitment to advancing technology and improving manufacturing processes.