The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 25, 2013
Filed:
Feb. 21, 2007
Applicants:
Young Cheol Kim, Yongin-si, KR;
Koo Hong Lee, Seoul, KR;
Jae Hak Yee, Singapore, SG;
Inventors:
Assignee:
Stats Chippac Ltd., Singapore, SG;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/3121 (2006.01); H01L 24/49 (2006.01); H01L 25/0657 (2006.01);
U.S. Cl.
CPC ...
Abstract
An integrated circuit package system includes a first integrated circuit die having die pads only adjacent a single edge of the first integrated circuit die, forming first L-shaped leadfingers adjacent the single edge, connecting the die pads and the first L-shaped leadfingers, and encapsulating the die pads and portions of the first L-shaped leadfingers to form a first package.