Company Filing History:
Years Active: 2009-2014
Title: Young Cheol Kim: Innovator in Integrated Circuit Packaging
Introduction
Young Cheol Kim is a prominent inventor based in Yongin-si, South Korea. He has made significant contributions to the field of integrated circuit packaging, holding a total of 10 patents. His work focuses on innovative solutions that enhance the performance and reliability of electronic devices.
Latest Patents
Among his latest patents is an "Integrated circuit package system with bonding lands." This invention features a first integrated circuit die with die pads located only adjacent to a single edge, creating first bonding lands that connect the die pads and are encapsulated to form a first package. Another notable patent is the "Integrated circuit package system with contoured encapsulation and method for manufacturing thereof." This method involves providing a carrier, mounting an integrated circuit die, and forming an encapsulation with a multi-sloped side to reduce ejection stress, along with external interconnects on both sides of the carrier.
Career Highlights
Young Cheol Kim is currently employed at Stats Chippac Pte. Ltd., where he continues to develop cutting-edge technologies in integrated circuit packaging. His expertise and innovative mindset have positioned him as a key player in the industry.
Collaborations
Throughout his career, Young Cheol Kim has collaborated with talented individuals such as Koo Hong Lee and Jae Hak Yee. These partnerships have fostered a creative environment that encourages the development of groundbreaking technologies.
Conclusion
Young Cheol Kim's contributions to integrated circuit packaging demonstrate his commitment to innovation and excellence in the field. His patents reflect a deep understanding of the complexities involved in electronic device manufacturing, making him a valuable asset to the industry.