The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 29, 2011
Filed:
Oct. 14, 2009
Young Cheol Kim, Yongin-si, KR;
Koo Hong Lee, Seoul, KR;
Jae Hak Yee, Shanghai, CN;
Ii Kwon Shim, Singapore, SG;
Young Cheol Kim, Yongin-si, KR;
Koo Hong Lee, Seoul, KR;
Jae Hak Yee, Shanghai, CN;
Ii Kwon Shim, Singapore, SG;
Stats Chippac Ltd., Singapore, SG;
Abstract
A stackable multi-chip package system is provided including forming an external interconnect having a base and a tip, connecting a first integrated circuit die and the base, stacking a second integrated circuit die over the first integrated circuit die in an active side to active side configuration, connecting the second integrated circuit die and the base, and molding the first integrated circuit die, the second integrated circuit die, and the external interconnect partially exposed.