This inventor holds 34 USPTO granted patents and 1 published patent application, primarily in Integrated Circuit Packaging. Top assignees: Stats Chippac Pte. Ltd., Amkor Technology, Inc., St Assembly Test Services Inc.. Active years: 2002-2015.
Location History:
- S.K. Mansion, SG (2003)
- Sam-Kiang Mansion, SG (2004)
- Singapore, KR (2005)
- Seoul, KR (2002 - 2009)
- Singapore, SG (2002 - 2015)
- Shanghai, CN (2011 - 2015)
Company Filing History:
17 out of 1,842 
13 out of 1,009 
4 out of 103 Years Active: 2002-2015
Areas of Expertise:
Title: **Innovations of Jae Hak Yee – A Pioneer in Integrated Circuit Packaging**
Introduction
Jae Hak Yee, based in Shanghai, China, is a distinguished inventor with a remarkable portfolio of 34 patents. His contributions to the field of integrated circuit packaging have revolutionized the way electronic components are designed and utilized in modern technology.
Latest Patents
Among his latest innovations, Jae Hak Yee has developed a stackable multi-chip package system. This system includes forming an inter-chip structure adjacent to an external interconnect that features both a base and a tip. The design connects a first integrated circuit die mounted over the inter-chip structure with the outer portion of the base, while a second integrated circuit die is mounted under the inter-chip structure, establishing a comprehensive interconnection for enhanced performance.
Another significant patent by Yee is the integrated circuit package-in-package system. This innovation involves mounting first integrated circuits stacked in a first offset configuration over a die-attach paddle, with a second set of integrated circuits stacked below in an offset manner. The encapsulation technique he devised allows both sets of circuits to function effectively, with leads partially exposed for optimal connectivity.
Career Highlights
Jae Hak Yee's career includes pivotal roles at prominent companies such as Stats Chippac Pte. Ltd. and Amkor Technology, Inc. His experience in these companies has enabled him to further the development of advanced packaging technologies and innovative solutions in the semiconductor industry.
Collaborations
Throughout his career, Jae Hak Yee has collaborated with notable professionals including Young Suk Chung and Jae Hun Ku. These collaborations have facilitated the exchange of innovative ideas and techniques, leading to advancements in integrated circuit technology and patent filings.
Conclusion
Jae Hak Yee's innovative spirit and dedication to enhancing integrated circuit packaging systems have made him a valuable contributor to the field. His numerous patents not only showcase his inventiveness but also represent significant advancements in semiconductor technology. As he continues to innovate, his impact on the industry will likely inspire future generations of inventors and engineers.