The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 03, 2015
Filed:
Dec. 06, 2007
Chee Keong Chin, Shanghai, CN;
Jae Hak Yee, Shanghai, CN;
Yu Feng Feng, Shanghai, CN;
Frederick Cruz Santos, Shanghai, CN;
Chee Keong Chin, Shanghai, CN;
Jae Hak Yee, Shanghai, CN;
Yu Feng Feng, Shanghai, CN;
Frederick Cruz Santos, Shanghai, CN;
STATS ChipPAC Ltd., Singapore, SG;
Abstract
An integrated circuit package-in-package system is provided including mounting first integrated circuits stacked in a first offset configuration over a die-attach paddle having a first edge and a second edge, opposing the first edge; connecting the first integrated circuits and a second edge lead adjacent the second edge; mounting second integrated circuits stacked in a second offset configuration, below and to the die-attach paddle; connecting the second integrated circuits and a first edge lead adjacent to the first edge; and encapsulating the first integrated circuits, second integrated circuits, and the die-attach paddle, with the first edge lead and the second edge lead partially exposed.