Shanghai, China

Chee Keong Chin

USPTO Granted Patents = 16 

Average Co-Inventor Count = 2.3

ph-index = 5

Forward Citations = 58(Granted Patents)


Location History:

  • Hsin-Chiu Hsien, TW (2011 - 2013)
  • Butterworth, MY (2014)
  • Shanghai, CN (2011 - 2022)

Company Filing History:


Years Active: 2011-2025

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16 patents (USPTO):Explore Patents

Title: The Innovations of Chee Keong Chin

Introduction

Chee Keong Chin is a prominent inventor based in Shanghai, China, known for his significant contributions to the field of semiconductor technology. With a total of 16 patents to his name, Chin has made remarkable advancements that enhance the efficiency and reliability of semiconductor devices.

Latest Patents

One of his latest patents is focused on a semiconductor device with reduced stress during the die pick and place process. This innovation allows semiconductor dies formed on a wafer to be picked with minimal stress, thereby preventing cracking and damage. The process involves laminating a die attach film (DAF) layer onto an inactive surface of the wafer, which is then cut in the outline of the dies. This method enables the inactive surface to be supported on a vacuum chuck without the need for dicing tape, facilitating the transfer of dies using a pick and place robot.

Another notable patent addresses the aperture structure on the backside of semiconductor components to alleviate delamination in stacked packaging. This process includes forming one or more apertures on the component's backside and creating a vacuum in a mold chase. The engagement of the component backside with a mold compound in the mold chase results in an aperture structure that minimizes the likelihood of trapped air after vacuum creation. The characteristics of the apertures, such as width, depth, and pitch, can be adjusted to optimize performance.

Career Highlights

Throughout his career, Chee Keong Chin has worked with several notable companies, including Stats Chippac Pte. Ltd. and SanDisk Semiconductor (Shanghai) Co. Ltd. His experience in these organizations has contributed to his expertise in semiconductor technology and innovation.

Collaborations

Chin has collaborated with various professionals in the industry, including Junrong Yan and Kim Lee Bock. These collaborations have further enriched his work and led to advancements in semiconductor applications.

Conclusion

Chee Keong Chin's contributions to semiconductor technology through his innovative patents demonstrate his commitment to enhancing the field. His work not only addresses current challenges but also paves the way for future advancements in semiconductor devices.

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