The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 17, 2019
Filed:
Jun. 22, 2017
Sandisk Semiconductor (Shanghai) Co., Ltd., Shanghai, CN;
Hang Zhang, Shanghai, CN;
Weili Wang, Shanghai, CN;
Junrong Yan, Shanghai, CN;
Kim Lee Bock, Shanghai, CN;
Chee Keong Chin, Shanghai, CN;
Chong Un Tan, Shanghai, CN;
Xin Tian, Shanghai, CN;
SanDisk Semiconductor (Shanghai) Co. Ltd., Shanghai, CN;
Abstract
A semiconductor die is disclosed including corner recesses to prevent cracking of the semiconductor die during fabrication. Prior to dicing the semiconductor die from the wafer, recesses may be formed in the wafer at corners between any pair of semiconductor die. The recesses may be formed by a laser or photolithographic processes in the kerf area between semiconductor die. Once formed, the corner recesses prevent cracking and damage to semiconductor die which could otherwise occur at the corners of adjacent semiconductor die as the adjacent semiconductor die move relative to each other during the backgrind process.