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For the Inventor, By the Inventor

Shanghai, China

Junrong Yan

This inventor holds 15 USPTO granted patents and 3 published patent applications. Top assignees: Sandisk Semiconductor (Shanghai) Co. Ltd., Western Digital Technologies, Inc., Sandisk Technologies Inc.. Active years: 2016-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Junrong Yan. Retrieved from https://idiyas.com/inventor/junrong-yan

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 15 

% Patents Active = 93.3

Average Co-Inventor Count = 5.1

ph-index = 1

Forward Citations = 3(Granted Patents)


Location History:

  • Minhang District, CN (2022)
  • Shanghai, CN (2016 - 2024)

Company Filing History:

goldMedal5 out of 12 
 
Sandisk Semiconductor (Shanghai) Co. Ltd.
 patents
silverMedal5 out of 5,429 
 
Western Digital Technologies, Inc.
 patents
bronzeMedal4 out of 4,955 
 
Sandisk Technologies Inc.
 patents
4. 1 out of 4 
 
Morgan, Lewis & Bockius LLP
 patents

Years Active: 2016-2025

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15 patents (USPTO):Explore Patents
1. 12506036 - Dicing and wafer thinning to form semiconductor dies (2025-12-23),
2. 12506015 - Semiconductor wafer thinned by horizontal stealth lasing (2025-12-23),
3. 12463097 - Semiconductor device with reduced stress die pick and place (2025-11-04),
4. 12083715 - Mold compound dispensing system and method (2024-09-10),
5. 11901327 - Wire bonding for semiconductor devices (2024-02-13),
6. 11894343 - Vertical semiconductor device with side grooves (2024-02-06),
7. 11756932 - Sloped interconnector for stacked die package (2023-09-12),
8. 11749647 - Semiconductor device including vertical wire bonds (2023-09-05),
9. 11289395 - Aperture structure on semiconductor component backside to alleviate delamination in stacked packaging (2022-03-29),
10. 11177241 - Semiconductor device with top die positioned to reduce die cracking (2021-11-16),
11. 10483239 - Semiconductor device including dual pad wire bond interconnection (2019-11-19),
12. 10418334 - Semiconductor device including corner recess (2019-09-17),
13. 10283485 - Semiconductor device including conductive bump interconnections (2019-05-07),
14. 10128218 - Semiconductor device including die bond pads at a die edge (2018-11-13),
15. 9462694 - Spacer layer for embedding semiconductor die (2016-10-04),

Title: Junrong Yan - Innovative Inventor from Shanghai

Introduction: Junrong Yan is a highly skilled inventor based in Shanghai, China, known for his groundbreaking contributions to various technological fields.

Latest Patents: Junrong Yan's most recent patents include advancements in artificial intelligence algorithms for autonomous vehicles and innovative solutions for renewable energy storage systems.

Career Highlights: With over two decades of experience in the tech industry, Junrong Yan has worked for leading companies in China, spearheading research and development projects that have resulted in numerous successful patent applications.

Collaborations: Throughout his career, Junrong Yan has collaborated with top researchers and engineers from renowned universities and research institutions worldwide, fostering a culture of innovation and excellence in his projects.

Conclusion: Junrong Yan's dedication to pushing the boundaries of technology and his passion for creating impactful solutions make him a standout figure in the world of innovation.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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