The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 04, 2016

Filed:

Dec. 05, 2014
Applicant:

Sandisk Semiconductor (Shanghai) Co., Ltd., Shanghai, CN;

Inventors:

Junrong Yan, Shanghai, CN;

Weili Wang, Shanghai, CN;

Li Wang, Shanghai, CN;

Pradeep Rai, Jangipur, IN;

Xin Lu, Shanghai, CN;

Jianbin Gu, Shanghai, CN;

Peng Lu, Shanghai, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 16/02 (2006.01); H05K 1/18 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); H01L 25/065 (2013.01); H01L 2224/05553 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48145 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/49175 (2013.01); H05K 2201/10159 (2013.01); H05K 2201/10515 (2013.01); H05K 2201/2018 (2013.01); Y02P 70/611 (2015.11); Y10T 428/24273 (2015.01);
Abstract

A semiconductor device, and a method of its manufacture, are disclosed. The semiconductor device includes a semiconductor die, such as a controller die, mounted on a surface of a substrate. A spacer layer is also mounted to the substrate, with the semiconductor die fitting within an aperture or a notch formed through first and second major opposed surfaces of the spacer layer. Additional semiconductor die, such as flash memory die, may be mounted atop the spacer layer.


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