The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 13, 2024
Filed:
Feb. 26, 2021
Applicant:
Western Digital Technologies, Inc., San Jose, CA (US);
Inventors:
Yang Lei, Shanghai, CN;
Xiaofeng Di, Shanghai, CN;
Yuyun Lou, Shanghai, CN;
Zhonghua Qian, Shanghai, CN;
Junrong Yan, Shanghai, CN;
Assignee:
WESTERN DIGITAL TECHNOLOGIES, INC., San Jose, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/48 (2013.01); H01L 24/04 (2013.01); H01L 24/78 (2013.01); H01L 24/85 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/4805 (2013.01); H01L 2224/4807 (2013.01); H01L 2224/4845 (2013.01); H01L 2224/48451 (2013.01); H01L 2224/48453 (2013.01); H01L 2224/48463 (2013.01); H01L 2224/48482 (2013.01); H01L 2224/7895 (2013.01); H01L 2224/8503 (2013.01); H01L 2924/381 (2013.01);
Abstract
A semiconductor device includes an integrated circuit die having bond pads and a bond wires. The bond wires are connected to respective ones of the bond pads by a ball bond. An area of contact between the ball bond and the bond pad has a predetermined shape that is non-circular and includes at least one axis of symmetry. A ratio of the ball bond length to the ball bond width may be equal to a ratio of the bond pad length to the bond pad width.