Xiaofeng Di

Title: Inventor Xiaofeng Di: Pioneering Advancements in Semiconductor Technology

Introduction

Xiaofeng Di is an innovative inventor based in Shanghai, China, known for his significant contributions to semiconductor technology. With a portfolio of four patents, he has made noteworthy advancements that showcase his expertise and forward-thinking approach to engineering and design in the semiconductor industry.

Latest Patents

Xiaofeng Di's latest patents include innovative methods related to wire bonding in semiconductor devices. One of his patents describes a semiconductor device that features an integrated circuit die with bond pads and bond wires. The bond wires connect to the bond pads through a ball bond, where the area of contact has a predetermined non-circular shape with at least one axis of symmetry. Furthermore, the design emphasizes a ratio between the ball bond length and width, mirroring the dimensions of the bond pad. Another inventive patent involves a semiconductor device utilizing vertical wire bonds on substrate contact fingers. This technique allows semiconductor dies to be mounted on a substrate and electrically coupled, resulting in vertical columns of wire bonds. This arrangement minimizes the area required on the contact finger, streamlining the overall design.

Career Highlights

Throughout his career, Xiaofeng Di has made an impact in renowned companies such as Sandisk Semiconductor (Shanghai) Co. Ltd. and Western Digital Technologies, Inc. His work has consistently pushed the boundaries of what's possible in semiconductor design and implementation.

Collaborations

Collaborating with esteemed colleagues like Junrong Yan and Chee Keong Chin, Xiaofeng has fostered a collaborative environment that encourages innovation and technological advancement. These partnerships have been instrumental in developing groundbreaking solutions within the semiconductor domain.

Conclusion

Xiaofeng Di's contributions to semiconductor technology illustrate his status as a leading inventor in the field. With his innovative patents and dynamic collaborations, he continues to influence the landscape of technology, paving the way for future advancements in the semiconductor industry.