The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 05, 2023
Filed:
Dec. 30, 2020
Western Digital Technologies, Inc., San Jose, CA (US);
Xiaofeng Di, Shanghai, CN;
Junrong Yan, Shanghai, CN;
CheeKeong Chin, Shanghai, CN;
Weili Wang, Shanghai, CN;
Xin Lu, Shanghai, CN;
Qi Deng, Shanghai, CN;
Chaur Yang Ng, Pulau Pinang, MY;
Cong Zhang, Shanghai, CN;
Chenlin Yang, Shanghai, CN;
Chin-Tien Chiu, Taichung, TW;
Western Digital Technologies, Inc., San Jose, CA (US);
Abstract
A semiconductor device includes a vertical column of wire bonds on substrate contact fingers of the device. Semiconductor dies are mounted on a substrate, and electrically coupled to the substrate such that groups of semiconductor dies may have bond wires extending to the same contact finger on the substrate. By bonding those wires to the contact finger in a vertical column, as opposed to separate, side-by-side wire bonds on the contact finger, an area of the contact finger may be reduced.