Taichung, Taiwan

Chin-Tien Chiu

USPTO Granted Patents = 64 

 

Average Co-Inventor Count = 4.4

ph-index = 5

Forward Citations = 146(Granted Patents)

Forward Citations (Not Self Cited) = 135(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Taichung, CN (2017 - 2018)
  • Taichung, TW (2004 - 2024)

Company Filing History:


Years Active: 2004-2025

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Areas of Expertise:
Semiconductor Wafer
Thermoelectric Semiconductor Device
Vertical Wire Bonds
High Capacity Semiconductor Device
Integrated Electronic Element Module
Heterogeneous Fan-Out Structures
Printed Circuit Board
Electromagnetic Absorption
Stacked-Dies Package
Memory Card Design
Interconnected Package
Redistribution Layer
64 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Chin-Tien Chiu in Semiconductor Technology

Introduction: Chin-Tien Chiu, a prominent inventor based in Taichung, Taiwan, has made significant strides in the field of semiconductor technology. With an impressive portfolio of 64 patents, his work has greatly contributed to advancements in semiconductor devices and their manufacturing processes.

Latest Patents: Among his latest innovations, Chin-Tien Chiu has developed a semiconductor wafer that incorporates semiconductor dies along with unique laser grooves formed in the scribe lines. These grooves are strategically placed along the long edges of the semiconductor dies, extending between two adjacent dies. This design ensures that when the dies are diced, portions of the corners are effectively removed, optimizing the production process.

Another noteworthy patent details a method for forming semiconductor devices with vertical contact fingers. This method involves creating vertical contact fingers on a substrate that has flexible side portions. By forming these contact fingers near the edges of the substrate, and subsequently encasing the device with a properly sized mold, Chin-Tien Chiu has improved the encapsulation process, allowing for greater efficiency in semiconductor device assembly.

Career Highlights: Throughout his career, Chin-Tien Chiu has lent his expertise to prominent companies in the technology sector. His tenure at Western Digital Technologies, Inc. and SanDisk Corporation enabled him to apply his innovative ideas in real-world applications, furthering the capabilities of semiconductor technologies.

Collaborations: Chin-Tien Chiu has collaborated with notable coworkers, including Hem P. Takiar and Chih-Chin Liao, contributing a wealth of knowledge and skill to the projects they undertook together. Their collective expertise has undoubtedly influenced the successful outcomes of their work in semiconductor innovation.

Conclusion: Chin-Tien Chiu stands as a testament to the power of innovation in the semiconductor industry. His ongoing contributions, underscored by his numerous patents, demonstrate a commitment to advancing technology and improving manufacturing processes. His work not only enhances the efficiency and performance of semiconductor devices but also paves the way for future advancements in the field.

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