The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 23, 2022

Filed:

Nov. 30, 2020
Applicant:

Western Digital Technologies, Inc., San Jose, CA (US);

Inventors:

Shineng Ma, Shanghai, CN;

Xuyi Yang, Shanghai, CN;

Chih-Chin Liao, Taiwan, TW;

Chin-Tien Chiu, Taichung, TW;

Jinxiang Huang, Shanghai, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/14 (2006.01); H05K 5/02 (2006.01); H05K 7/00 (2006.01); H05K 7/14 (2006.01); G06K 7/00 (2006.01); G06K 19/06 (2006.01); H01R 33/00 (2006.01); H05K 1/11 (2006.01); H01L 25/065 (2006.01); H01L 25/18 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/117 (2013.01); H01L 25/0657 (2013.01); H01L 25/18 (2013.01); H05K 1/181 (2013.01); H01L 2225/06506 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06562 (2013.01); H05K 2201/09754 (2013.01); H05K 2201/10159 (2013.01);
Abstract

A memory card includes a memory card body dimensioned to house at least one integrated circuit die package. The memory card body, in certain embodiments, includes a first surface spaced apart from a second surface and a plurality of side surfaces connecting the first surface to the second surface. The memory card also includes a contact pad disposed on at least one side surface of the plurality of side surfaces. The contact pad includes a first conductive layer, a second conductive layer, and an insulating layer disposed between the first conductive layer and the second conductive layer.


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