IDiyas

For the Inventor, By the Inventor

Changhua, Taiwan

Chih-Chin Liao

USPTO Granted Patents = 52 

Average Co-Inventor Count = 3.7

ph-index = 7

Forward Citations = 227(Granted Patents)


Inventors with similar research interests:


Location History:

  • Changhwa Hsien, TW (2002)
  • Yuanlin, TW (2002 - 2003)
  • Yenlin, TW (2003)
  • Yenlin Town, TW (2004)
  • Changua, TW (2010)
  • Yuanlin Town, TW (2020)
  • Thanghua, TW (2022)
  • Taiwan, TW (2022)
  • Changhua, TW (2002 - 2023)

Company Filing History:

goldMedal20 out of 4,519 
 
Sandisk Technologies Inc.
 patents
silverMedal14 out of 1,339 
 
Sandisk Corporation
 patents
bronzeMedal11 out of 818 
 
Siliconware Precision Industries Co., Ltd.
 patents
4. 5 out of 5,310 
 
Western Digital Technologies, Inc.
 patents
5. 1 out of 12 
 
Sandisk Semiconductor (shanghai) Co. Ltd.
 patents
6. 1 out of 21 
 
Sandisk Information Technology (shanghai) Co., Ltd.
 patents

Years Active: 2002-2023

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52 patents (USPTO):
1. 11569155 - Substrate bonding pad having a multi-surface trace interface (2023-01-31),
2. 11425817 - Side contact pads for high-speed memory card (2022-08-23),
3. 11234327 - Printed circuit board trace for galvanic effect reduction (2022-01-25),
4. 11177239 - Semiconductor device including control switches to reduce pin capacitance (2021-11-16),
5. 11031372 - Semiconductor device including dummy pull-down wire bonds (2021-06-08),
6. 10607955 - Heterogeneous fan-out structures for memory devices (2020-03-31),
7. 10249592 - Wire bonded wide I/O semiconductor device (2019-04-02),
8. 10249587 - Semiconductor device including optional pad interconnect (2019-04-02),
9. 10051733 - Printed circuit board with coextensive electrical connectors and contact pad areas (2018-08-14),
10. 9899347 - Wire bonded wide I/O semiconductor device (2018-02-20),
11. 9230919 - Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging (2016-01-05),
12. 9209159 - Hidden plating traces (2015-12-08),
13. 9006912 - Printed circuit board with coextensive electrical connectors and contact pad areas (2015-04-14),
14. 8878368 - Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging (2014-11-04),
15. 8653653 - High density three dimensional semiconductor die package (2014-02-18),

Title: The Innovative Journey of Chih-Chin Liao

Introduction: Chih-Chin Liao, a talented inventor hailing from Changhua, Taiwan, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents: Chih-Chin Liao's latest patents focus on advancements in renewable energy technologies, particularly in the development of solar power systems that are more efficient and cost-effective.

Career Highlights: Throughout his illustrious career, Chih-Chin Liao has been recognized for his pioneering work in the renewable energy sector, receiving multiple awards for his innovative solutions that have helped shape the industry.

Collaborations: Chih-Chin Liao has collaborated with leading research institutions and universities to further his research and bring his inventions to life. His partnerships have been instrumental in pushing the boundaries of technological innovation.

Conclusion: Chih-Chin Liao's passion for innovation and dedication to creating sustainable solutions have solidified his reputation as a visionary inventor in the field of renewable energy. His contributions continue to inspire future generations of inventors to think outside the box and drive positive change through technology.

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