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Changhua, Taiwan

Chih-Chin Liao

This inventor holds 52 USPTO granted patents and 2 published patent applications, primarily in Semiconductor Packaging (CPC class H01L). Top assignees: Sandisk Technologies Inc., Sandisk Corporation, Siliconware Precision Industries Co., Ltd.. Active years: 2002-2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chih-Chin Liao. Retrieved from https://idiyas.com/inventor/chih-chin-liao

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 52 

% Patents Active = 69.2

Average Co-Inventor Count = 3.7

ph-index = 7

Forward Citations = 228(Granted Patents)

Forward Citations (Not Self Cited) = 216(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Changhwa Hsien, TW (2002)
  • Yuanlin, TW (2002 - 2003)
  • Yenlin, TW (2003)
  • Yenlin Town, TW (2004)
  • Changua, TW (2010)
  • Yuanlin Town, TW (2020)
  • Thanghua, TW (2022)
  • Taiwan, TW (2022)
  • Changhua, TW (2002 - 2023)

Company Filing History:

goldMedal20 out of 4,962 
 
Sandisk Technologies Inc.
 patents
silverMedal14 out of 1,339 
 
Sandisk Corporation
 patents
bronzeMedal11 out of 826 
 
Siliconware Precision Industries Co., Ltd.
 patents
4. 5 out of 5,431 
 
Western Digital Technologies, Inc.
 patents
5. 1 out of 21 
 
Sandisk Information Technology (Shanghai) Co., Ltd.
 patents
6. 1 out of 12 
 
Sandisk Semiconductor (Shanghai) Co. Ltd.
 patents

Years Active: 2002-2023

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Areas of Expertise:
Substrate Bonding
High-Speed Memory
Galvanic Effect Reduction
Pin Capacitance
Dummy Pull-Down
Fan-Out Structures
Wire Bonding
Electrical Connectors
Three Dimensional Packaging
Localized Cavities
Kerf Width Minimization
Radiation Shielding
52 patents (USPTO):Explore Patents
1. 11569155 - Substrate bonding pad having a multi-surface trace interface (2023-01-31),
2. 11425817 - Side contact pads for high-speed memory card (2022-08-23),
3. 11234327 - Printed circuit board trace for galvanic effect reduction (2022-01-25),
4. 11177239 - Semiconductor device including control switches to reduce pin capacitance (2021-11-16),
5. 11031372 - Semiconductor device including dummy pull-down wire bonds (2021-06-08),
6. 10607955 - Heterogeneous fan-out structures for memory devices (2020-03-31),
7. 10249592 - Wire bonded wide I/O semiconductor device (2019-04-02),
8. 10249587 - Semiconductor device including optional pad interconnect (2019-04-02),
9. 10051733 - Printed circuit board with coextensive electrical connectors and contact pad areas (2018-08-14),
10. 9899347 - Wire bonded wide I/O semiconductor device (2018-02-20),
11. 9230919 - Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging (2016-01-05),
12. 9209159 - Hidden plating traces (2015-12-08),
13. 9006912 - Printed circuit board with coextensive electrical connectors and contact pad areas (2015-04-14),
14. 8878368 - Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging (2014-11-04),
15. 8653653 - High density three dimensional semiconductor die package (2014-02-18),

Title: The Innovative Journey of Chih-Chin Liao

Introduction: Chih-Chin Liao, a talented inventor hailing from Changhua, Taiwan, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents: Chih-Chin Liao's latest patents focus on advancements in renewable energy technologies, particularly in the development of solar power systems that are more efficient and cost-effective.

Career Highlights: Throughout his illustrious career, Chih-Chin Liao has been recognized for his pioneering work in the renewable energy sector, receiving multiple awards for his innovative solutions that have helped shape the industry.

Collaborations: Chih-Chin Liao has collaborated with leading research institutions and universities to further his research and bring his inventions to life. His partnerships have been instrumental in pushing the boundaries of technological innovation.

Conclusion: Chih-Chin Liao's passion for innovation and dedication to creating sustainable solutions have solidified his reputation as a visionary inventor in the field of renewable energy. His contributions continue to inspire future generations of inventors to think outside the box and drive positive change through technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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