For the Inventor, By the Inventor

Enter assignee name

Shanghai, China

Sandisk Information Technology (shanghai) Co., Ltd.

USPTO Granted Patents = 21

EPO Patents = 1

Forward Citations = 57

Loading Chart...

Loading Chart...

48 inventors (with patents filed for the assignee):

Chin-Tien Chiu (12 out of 64 patents)

Hem P Takiar (9 out of 198 patents)

Chin Tien Chiu (7 out of 8 patents)

4. Cheeman Yu (7 out of 25 patents)

5. Zhong Lu (6 out of 21 patents)

6. Ye Bai (5 out of 6 patents)

7. Kaiyou Qian (4 out of 5 patents)

8. Gursharan Singh (3 out of 3 patents)

9. Zhongli Ji (3 out of 5 patents)

10. Dacheng Huang (3 out of 3 patents)

11. Yangming Liu (2 out of 9 patents)

12. Ning Ye (2 out of 39 patents)

13. Shineng Ma (2 out of 6 patents)

14. Fuqiang Xiao (2 out of 4 patents)

15. Kim Lee Bock (2 out of 6 patents)

21 patents: Sort by Forward Citations

1. 11177239 - Semiconductor device including control switches to reduce pin capacitance (2021-11-16),

2. 11031371 - Semiconductor package and method of fabricating semiconductor package (2021-06-08),

3. 10818575 - Datacenter 3D solid state drives with matrix cooling (2020-10-27),

4. 10811386 - Semiconductor device (2020-10-20),

5. 10734354 - Semiconductor device including optically connected wafer stack (2020-08-04),

6. 10490529 - Angled die semiconductor device (2019-11-26),

7. 10325881 - Vertical semiconductor device having a stacked die block (2019-06-18),

8. 10242965 - Semiconductor device including interconnected package on package (2019-03-26),

9. 10236276 - Semiconductor device including vertically integrated groups of semiconductor packages (2019-03-19),

10. 10177119 - Fan out semiconductor device including a plurality of semiconductor die (2019-01-08),

11. 9947606 - Semiconductor device including electromagnetic absorption and shielding (2018-04-17),

12. 9773766 - Semiconductor device including independent film layer for embedding and/or spacing semiconductor die (2017-09-26),

13. 9704797 - Waterfall wire bonding (2017-07-11),

14. 9595454 - Semiconductor device including electromagnetic absorption and shielding (2017-03-14),

15. 9362244 - Wire tail connector for a semiconductor device (2016-06-07),

Sandisk Information Technology (Shanghai) Co., Ltd. is a leading provider of flash storage solutions for data-intensive enterprises. With a strong focus on innovation and technology, the company offers a wide range of products and services to meet the evolving needs of its customers. Leveraging cutting-edge research and development, Sandisk is committed to delivering high-quality, reliable solutions that drive business growth and enhance data management efficiency.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 23 2025

21 Patents

#128 in Shanghai

#1,245 in China

#29,053 in the World

Shanghai, China

Sandisk Information Technology (shanghai) Co., Ltd.

Forward Citations = 57

48 inventors:

Chin-Tien Chiu (12 out of 64 patents)

Hem P Takiar (9 out of 198 patents)

Chin Tien Chiu (7 out of 8 patents)

4. Cheeman Yu (7 out of 25 patents)

5. Zhong Lu (6 out of 21 patents)

Please report any incorrect information to support@idiyas.com

Loading…