The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 16, 2021
Filed:
Mar. 08, 2018
Applicant:
Sandisk Information Technology (Shanghai) Co., Ltd., Shanghai, CN;
Inventors:
Shineng Ma, Shanghai, CN;
Chin-Tien Chiu, Taichung, TW;
Chih-Chin Liao, Changhua, TW;
Ye Bai, Shanghai, CN;
Yazhou Zhang, Shanghai, CN;
Yanwen Bai, Shanghai, CN;
Yangming Liu, Shanghai, CN;
Assignee:
SanDisk Information Technology (Shanghai) Co., Ltd., Shanghai, CN;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2006.01); H01H 59/00 (2006.01); H01L 25/18 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01H 59/0009 (2013.01); H01L 25/0652 (2013.01); H01L 25/18 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48465 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06506 (2013.01); H01L 2225/06527 (2013.01); H01L 2225/06531 (2013.01); H01L 2225/06551 (2013.01); H01L 2225/06562 (2013.01); H01L 2225/06575 (2013.01); H01L 2924/181 (2013.01);
Abstract
A semiconductor device including control switches enabling a semiconductor die in a stack of semiconductor die to send or receive a signal, while electrically isolating the remaining die in the die stack. Parasitic pin cap is reduced or avoided by electrically isolating the non-enabled semiconductor die in the die stack.