The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 11, 2017
Filed:
May. 18, 2011
Applicants:
Zhong LU, Shanghai, CN;
Fen Yu, Shanghai, CN;
Chin Tien Chiu, Taichung, CN;
Cheeman Yu, Fremont, CA (US);
Fuqiang Xiao, Shanghai, CN;
Inventors:
Zhong Lu, Shanghai, CN;
Fen Yu, Shanghai, CN;
Chin Tien Chiu, Taichung, CN;
Cheeman Yu, Fremont, CA (US);
Fuqiang Xiao, Shanghai, CN;
Assignee:
SanDisk Information Technology (Shanghai) Co., Ltd., Shanghai, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49866 (2013.01); H01L 21/768 (2013.01); H01L 23/49811 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 24/85 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/45 (2013.01); H01L 24/73 (2013.01); H01L 24/78 (2013.01); H01L 2224/03013 (2013.01); H01L 2224/03614 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05026 (2013.01); H01L 2224/05124 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/06145 (2013.01); H01L 2224/06155 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/45015 (2013.01); H01L 2224/45139 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/45164 (2013.01); H01L 2224/45565 (2013.01); H01L 2224/45664 (2013.01); H01L 2224/4847 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48096 (2013.01); H01L 2224/48145 (2013.01); H01L 2224/48147 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48456 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/48471 (2013.01); H01L 2224/48624 (2013.01); H01L 2224/48644 (2013.01); H01L 2224/48724 (2013.01); H01L 2224/48824 (2013.01); H01L 2224/48844 (2013.01); H01L 2224/48847 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/78301 (2013.01); H01L 2224/78349 (2013.01); H01L 2224/85181 (2013.01); H01L 2224/85186 (2013.01); H01L 2224/85205 (2013.01); H01L 2224/85399 (2013.01); H01L 2224/85948 (2013.01); H01L 2224/92247 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06506 (2013.01); H01L 2225/06562 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01025 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01057 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/20104 (2013.01); H01L 2924/20105 (2013.01);
Abstract
A wire bonded structure for a semiconductor device is disclosed. The wire bonded structure comprises a bonding pad; and a continuous length of wire mutually diffused with the bonding pad, the wire electrically coupling the bonding pad with a first electrical contact and a second electrical contact different from the first electrical contact.