The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 08, 2019
Filed:
Jun. 12, 2017
Sandisk Information Technology (Shanghai) Co., Ltd., Shanghai, CN;
Cong Zhang, Shanghai, CN;
Fuqiang Xiao, Shanghai, CN;
Bin Xu, Shanghai, CN;
Haijun Wu, Shanghai, CN;
Chin Tien Chiu, Taichung, TW;
Zengyu Zhou, Shanghai, CN;
SanDisk Information Technology (Shanghai) Co., Ltd., Shanghai, CN;
Abstract
A semiconductor package is disclosed including a number of stacked semiconductor die, electrically connected to each other with wire bonds. The stacked semiconductor die are provided in a mold compound such that a spacing exists between a top die in the die stack and a surface of the mold compound. The wire bonds to the top die may be provided in the spacing. An RDL pad is affixed to the surface of the mold compound. Columns of bumps may be formed on the die bond pads of the top die in the die stack to electrically couple the RDL pad to the die stack across the spacing.