The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 19, 2019
Filed:
Jun. 12, 2017
Applicant:
Sandisk Information Technology (Shanghai) Co., Ltd., Shanghai, CN;
Inventors:
Yangming Liu, Shanghai, CN;
Chin-Tien Chiu, Taichung, TW;
Zhongli Ji, Shanghai, CN;
Shaopeng Dong, Shanghai, CN;
Zengyu Zhou, Shanghai, CN;
Assignee:
SanDisk Information Technology (Shanghai) Co., Ltd., Shanghai, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/10 (2006.01); H01L 25/04 (2014.01); H01L 25/07 (2006.01); H01L 25/11 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01); H01L 25/075 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 25/105 (2013.01); H01L 25/50 (2013.01); H01L 25/043 (2013.01); H01L 25/0652 (2013.01); H01L 25/071 (2013.01); H01L 25/074 (2013.01); H01L 25/0756 (2013.01); H01L 25/117 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/48145 (2013.01); H01L 2225/06506 (2013.01); H01L 2225/06555 (2013.01); H01L 2225/06562 (2013.01); H01L 2225/06586 (2013.01); H01L 2225/1041 (2013.01); H01L 2225/1058 (2013.01);
Abstract
A semiconductor device is disclosed including at least first and second vertically stacked and interconnected groups of semiconductor packages. The first and second groups of semiconductor packages may differ from each other in the number of packages and functionality.