The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 14, 2017
Filed:
Apr. 26, 2012
Dacheng Huang, Shanghai, CN;
YE Bai, Shanghai, CN;
Kaiyou Qian, Shanghai, CN;
Chin-tien Chiu, Taichung, CN;
Dacheng Huang, Shanghai, CN;
Ye Bai, Shanghai, CN;
Kaiyou Qian, Shanghai, CN;
Chin-Tien Chiu, Taichung, CN;
SanDisk Information Technology (Shanghai) Co., Ltd., Shanghai, CN;
Abstract
A semiconductor device is disclosed including material for absorbing EMI and/or RFI The device includes a substrate (), one or more semiconductor die (), and molding compound around the one or more semiconductor die (). The material for absorbing EMI and/or RFI may be provided within or on a solder mask layer () on the substrate (). The device may further include EMI/RFI-absorbing material around the molding compound and in contact with the EMI/RFI-absorbing material on the substrate to completely enclose the one or more semiconductor die in EMI/RFI-absorbing material.