The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2020
Filed:
Feb. 27, 2018
Applicant:
Sandisk Information Technology (Shanghai) Co., Ltd., Shanghai, CN;
Inventors:
Chin-Tien Chiu, Taichung, TW;
Ye Bai, Shanghai, CN;
Shineng Ma, Shanghai, CN;
Ting Liu, Shanghai, CN;
Binbin Zheng, Shanghai, CN;
Lei Shi, Shanghai, CN;
Hem Takiar, Fremont, CA (US);
Assignee:
SanDisk Information Technology (Shanghai) Co., Ltd., Shanghai, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/075 (2006.01); H01L 25/16 (2006.01); H01L 31/12 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01); H01L 25/065 (2006.01); H04B 10/27 (2013.01); G01R 31/27 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0652 (2013.01); H01L 25/0657 (2013.01); H01L 25/167 (2013.01); H01L 31/125 (2013.01); G01R 31/275 (2013.01); H01L 2225/06534 (2013.01); H01L 2225/06555 (2013.01); H04B 10/27 (2013.01);
Abstract
A semiconductor device is disclosed including a stack of wafers having a densely configured 3D array of memory die. The memory die on each wafer may be arranged in clusters, with each cluster including an optical module providing an optical interconnection for the transfer of data to and from each cluster.