The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 31, 2020

Filed:

Jun. 28, 2017
Applicant:

Sandisk Semiconductor (Shanghai) Co. Ltd., Shanghai, CN;

Inventors:

Chin-Tien Chiu, Taichung, TW;

Chih-Chin Liao, Yuanlin Town, TW;

Weiting Jiang, Shanghai, CN;

Hem Takiar, Fremont, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2006.01); H01L 23/00 (2006.01); H01L 25/00 (2006.01); H01L 23/538 (2006.01); H01L 25/18 (2006.01); G11C 5/04 (2006.01);
U.S. Cl.
CPC ...
H01L 24/08 (2013.01); H01L 23/5389 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 25/065 (2013.01); H01L 25/0652 (2013.01); H01L 25/0657 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01); G11C 5/04 (2013.01); H01L 2224/02379 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/16221 (2013.01); H01L 2224/2518 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/73267 (2013.01); H01L 2225/06527 (2013.01); H01L 2225/06548 (2013.01); H01L 2225/06551 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/181 (2013.01);
Abstract

A device may include a fan-out structure that has a plurality of integrated circuits. The integrated circuits may be of different types, such as by being configured differently or configured to perform different functions. The fan-out structure may be coupled to another integrated circuit structure, such as a die stack. For example, the fan-out structure may be coupled to a top surface or a bottom surface of the integrated circuit structure, or may otherwise be disposed within a vertical profile defined by the integrated circuit structure. Horizontally-extending and vertically-extending paths may be disposed in between and around the combined fan-out structure and integrated circuit structure to enable the integrated circuits of the two structures to communicate.


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