The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 05, 2016
Filed:
Oct. 30, 2014
Sandisk Technologies Inc., Plano, TX (US);
Chin-Tien Chiu, Taichung, TW;
Chih-Chin Liao, Changhua, TW;
Ken Jian Ming Wang, San Francisco, CA (US);
Han-Shiao Chen, Taichung County, TW;
Cheeman Yu, Madison, WI (US);
Hem Takiar, Fremont, CA (US);
SanDisk Technologies Inc., Plano, TX (US);
Abstract
A rigid wave pattern formed on a first side of a substrate in a semiconductor die package. The rigid wave pattern aligns with and overlies the contact fingers formed on the second side of the substrate. The rigid wave pattern includes a first pattern with an etched portion and an unetched portion around the etched portion. When the substrate and dice are encased during the molding process, the rigid wave pattern effectively reduces deformation of and stresses on the dice, therefore substantially alleviating die cracking.