Company Filing History:

9 out of 4,519

Sandisk Technologies Inc.

Years Active: 2008-2018

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20 patents (USPTO):Sort by Forward Citations

Abstract keywords

1. 10051733 - Printed circuit board with coextensive electrical connectors and contact pad areas (2018-08-14),

2. 9230919 - Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging (2016-01-05),

3. 9209159 - Hidden plating traces (2015-12-08),

4. 9006912 - Printed circuit board with coextensive electrical connectors and contact pad areas (2015-04-14),

5. 8878368 - Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging (2014-11-04),

6. 8487441 - Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging (2013-07-16),

7. 8461675 - Substrate panel with plating bar structured to allow minimum kerf width (2013-06-11),

8. 8269323 - Integrated circuit package with etched leadframe for package-on-package interconnects (2012-09-18),

9. 8269321 - Low cost lead frame package and method for forming same (2012-09-18),

10. 8217522 - Printed circuit board with coextensive electrical connectors and contact pad areas (2012-07-10),

11. 8193613 - Semiconductor die having increased usable area (2012-06-05),

12. 8129272 - Hidden plating traces (2012-03-06),

13. 7967184 - Padless substrate for surface mounted components (2011-06-28),

14. 7872335 - Lead frame-BGA package with enhanced thermal performance and I/O counts (2011-01-18),

15. 7806731 - Rounded contact fingers on substrate/PCB for crack prevention (2010-10-05),

Title: Innovations by Ken Jian Ming Wang in Printed Circuit Board Technology

Introduction

Ken Jian Ming Wang is an inventive force located in San Francisco, CA, specializing in advanced technologies with a significant portfolio that includes 20 patents. His work primarily focuses on innovations in printed circuit board (PCB) technology, making notable contributions to the field of electronics.

Latest Patents

Among Wang's notable inventions is a groundbreaking patent for a printed circuit board with coextensive electrical connectors and contact pad areas. This design allows for areas of the contact pads where the traces and/or vias are located to be etched away, thereby ensuring electrical isolation between the traces, vias, and contact pads. Another significant patent involves a rigid wave pattern design on chip carrier substrates and printed circuit boards for semiconductor and electronic sub-system packaging. This rigid wave pattern is engineered to align with contact fingers on the substrate's second side, effectively minimizing deformation and stresses on the semiconductor dice during the molding process, which in turn alleviates issues related to die cracking.

Career Highlights

Ken Jian Ming Wang has contributed his expertise to several reputable companies throughout his career, including SanDisk Technologies Inc. and SanDisk Corporation. His perseverance and innovative spirit have positioned him as a valued inventor and leader in the technology sector.

Collaborations

Throughout his career, Wang has collaborated with esteemed professionals such as Chih-Chin Liao and Han-Shiao Chen. These partnerships have undoubtedly enriched his work and expanded his reach within the field of electronics and semiconductor packaging.

Conclusion

Ken Jian Ming Wang's commitment to innovation in printed circuit board technology is evident through his impressive array of patents and collaborations. As technology continues to evolve, his contributions will undoubtedly play a crucial role in advancing electronic systems and components.

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