The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 28, 2011
Filed:
Nov. 16, 2005
Chih-chin Liao, Changhua, TW;
Ken Jian Ming Wang, San Francisco, CA (US);
Han-shiao Chen, Da-an Township, Taichung County, TW;
Chin-tien Chiu, Taichung, TW;
Jack Chang Chien, Kaoshiung, TW;
Shrikar Bhagath, San Jose, CA (US);
Cheemen Yu, Madison, WI (US);
Hem Takiar, Fremont, CA (US);
Chih-Chin Liao, Changhua, TW;
Ken Jian Ming Wang, San Francisco, CA (US);
Han-Shiao Chen, Da-an Township, Taichung County, TW;
Chin-Tien Chiu, Taichung, TW;
Jack Chang Chien, Kaoshiung, TW;
Shrikar Bhagath, San Jose, CA (US);
Cheemen Yu, Madison, WI (US);
Hem Takiar, Fremont, CA (US);
SanDisk Corporation, Milpitas, CA (US);
Abstract
A semiconductor package having a low profile is disclosed. In embodiments, a surface mounted component may be mounted directly to the core of the semiconductor package substrate, so that there is no conductive layer, plating layers or solder paste between the component and the substrate core. The surface mounted component may be any type of component which may be surface mounted on a substrate according to an SMT process, including for example passive components and various packaged semiconductors.