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Cheemen Yu

This inventor holds 32 USPTO granted patents and 1 published patent application. Top assignees: Sandisk Corporation, Sandisk Technologies Inc.. Active years: 2008-2015.

USPTO Granted Patents = 32 (Patent Applications = 1)

% Patents Active = 65.6

Average Co-Inventor Count = 4.5

ph-index = 5

Forward Citations = 121(Granted Patents)

Location History:

Fremont, CA (US) (2012 - 2013)
Madison, WI (US) (2008 - 2015)

Company Filing History:

Sandisk Technologies Inc.

patents

Years Active: 2008-2015

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Areas of Expertise:

Printed Circuit Board

Semiconductor Packaging

Memory Card Technology

Hybrid Technology

Stacked Semiconductor Packages

Die Package Design

Electrical Connectors

Substrate Warpage Control

Wire Bonding Techniques

Redistribution Layer

High Density Semiconductor

Adhesion Promotion Methods

32 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 9006912 - Printed circuit board with coextensive electrical connectors and contact pad areas (2015-04-14),

2. 8878346 - Molded SiP package with reinforced solder columns (2014-11-04),

3. 8728864 - Method of fabricating a memory card using SIP/SMT hybrid technology (2014-05-20),

4. 8637972 - Two-sided substrate lead connection for minimizing kerf width on a semiconductor substrate panel (2014-01-28),

5. 8487441 - Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging (2013-07-16),

6. 8470640 - Method of fabricating stacked semiconductor package with localized cavities for wire bonding (2013-06-25),

7. 8395246 - Two-sided die in a four-sided leadframe based package (2013-03-12),

8. 8318535 - Method of fabricating a memory card using SiP/SMT hybrid technology (2012-11-27),

9. 8294251 - Stacked semiconductor package with localized cavities for wire bonding (2012-10-23),

10. 8212360 - Semiconductor die having a redistribution layer (2012-07-03),

11. 8097495 - Die package with asymmetric leadframe connection (2012-01-17),

12. 8058099 - Method of fabricating a two-sided die in a four-sided leadframe based package (2011-11-15),

13. 7967184 - Padless substrate for surface mounted components (2011-06-28),

14. 7952179 - Semiconductor package having through holes for molding back side of package (2011-05-31),

15. 7939382 - Method of fabricating a semiconductor package having through holes for molding back side of package (2011-05-10),

Title: Cheemen Yu: A Leader in Printed Circuit Board Innovations

Introduction

Cheemen Yu is an accomplished inventor based in Madison, Wisconsin, holding an impressive total of 32 patents to his name. His innovative work primarily focuses on the advancement of printed circuit board technologies, where he has made significant contributions that enhance the performance and reliability of electronic devices.

Latest Patents

Among his latest inventions, Cheemen Yu has developed a printed circuit board featuring coextensive electrical connectors and contact pad areas. This innovation ensures that areas of the contact pads are strategically etched away to guarantee electrical isolation between traces, vias, and contact pads. Another notable patent involves a molded System in Package (SiP) design that incorporates reinforced solder columns, providing structural support to semiconductor die packages during their fabrication process. These advancements reflect his commitment to enhancing electronic component design.

Career Highlights

Cheemen has worked with reputable organizations such as SanDisk Corporation and SanDisk Technologies Inc., where he applied his expertise in electronic engineering to develop cutting-edge solutions. His tenure at these companies has solidified his reputation as a visionary in the field of circuit design.

Collaborations

Throughout his career, Cheemen Yu has collaborated with esteemed colleagues including Hem P. Takiar and Chih-Chin Liao. These partnerships have played a crucial role in driving forward innovative projects and patent developments that benefit the electronics industry.

Conclusion

Cheemen Yu continues to be a prominent figure in the realm of electronic innovation, showcasing how inventors can significantly impact technology through their patented inventions. With a portfolio of 32 patents, he exemplifies dedication and creativity in engineering, shaping the future of printed circuit boards and semiconductor packaging.

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