The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 25, 2013
Filed:
Jun. 30, 2008
Hem Takiar, Fremont, CA (US);
Shrikar Bhagath, San Jose, CA (US);
Cheemen Yu, Fremont, CA (US);
Chih-chin Liao, Changhua, TW;
Hem Takiar, Fremont, CA (US);
Shrikar Bhagath, San Jose, CA (US);
Cheemen Yu, Fremont, CA (US);
Chih-Chin Liao, Changhua, TW;
SanDisk Technologies Inc., Plano, TX (US);
Abstract
A method of fabricating a semiconductor die and a low profile semiconductor package are disclosed. The semiconductor package may include at least first and second stacked semiconductor die mounted to a substrate. The first and/or second semiconductor die may be fabricated with localized cavities through a bottom surface of the semiconductor die, along a side edge of the semiconductor die. The one or more localized cavities in a side take up less than the entire side. Thus, the localized cavities allow low height stacking of semiconductor die while providing each die with a high degree of structural integrity to prevent cracking or breaking of the die edge during fabrication.