The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 04, 2014
Filed:
Apr. 28, 2006
Applicants:
Chin-tien Chiu, Taichung, TW;
Hem Takiar, Fremont, CA (US);
Hui Liu, Shanghai, CN;
Jiang Hua Java Zhu, Shanghai, CN;
Jack Chang-chien, Kaoshiung, TW;
Cheemen Yu, Madison, WI (US);
Inventors:
Chin-Tien Chiu, Taichung, TW;
Hem Takiar, Fremont, CA (US);
Hui Liu, Shanghai, CN;
Jiang Hua Java Zhu, Shanghai, CN;
Jack Chang-Chien, Kaoshiung, TW;
Cheemen Yu, Madison, WI (US);
Assignee:
SanDisk Technologies Inc., Plano, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H05K 3/30 (2006.01); H05K 3/34 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H05K 2201/09781 (2013.01); H01L 2924/1433 (2013.01); H05K 2203/041 (2013.01); H05K 3/3421 (2013.01); H05K 2203/043 (2013.01); H05K 2201/10689 (2013.01); H05K 2201/2036 (2013.01); H01L 24/48 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48257 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H05K 3/303 (2013.01); H01L 2224/48247 (2013.01); H05K 3/3484 (2013.01); H01L 2225/06562 (2013.01);
Abstract
An integrated circuit, and a semiconductor die package formed therefrom, are disclosed including solder columns for adding structural support to the package during the fabrication process.