The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2015
Filed:
Jul. 09, 2012
Applicants:
Chih-chin Liao, Changhua, TW;
Han-shiao Chen, Taichung, TW;
Chin-tien Chiu, Taichung, TW;
Ken Jian Ming Wang, San Francisco, CA (US);
Cheemen Yu, Madison, WI (US);
Hem Takiar, Fremont, CA (US);
Inventors:
Chih-Chin Liao, Changhua, TW;
Han-Shiao Chen, Taichung, TW;
Chin-Tien Chiu, Taichung, TW;
Ken Jian Ming Wang, San Francisco, CA (US);
Cheemen Yu, Madison, WI (US);
Hem Takiar, Fremont, CA (US);
Assignee:
SanDisk Technologies Inc., Plano, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H05K 1/11 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H05K 1/111 (2013.01); H05K 1/115 (2013.01); H05K 3/429 (2013.01); H05K 2201/09381 (2013.01); H05K 2201/094 (2013.01); H05K 2201/09663 (2013.01); H05K 2201/0969 (2013.01); H05K 2201/10689 (2013.01); H01L 2924/0002 (2013.01);
Abstract
A printed circuit board is disclosed having coextensive electrical connectors and contact pad areas. Areas of the contact pads where the traces and/or vias are located may be etched away to ensure electrical isolation between the traces, vias and contact pads.