The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 18, 2012
Filed:
Aug. 28, 2007
Ken Jian Ming Wang, San Francisco, CA (US);
Matthew Vernon Kaufmann, Morgan Hill, CA (US);
Ken Jian Ming Wang, San Francisco, CA (US);
Matthew Vernon Kaufmann, Morgan Hill, CA (US);
Broadcom Corporation, Irvine, CA (US);
Abstract
According to one exemplary embodiment, a lead frame package includes a number of leads and a number of contacts, where each of the contacts is situated over one of the leads. The lead frame package further includes a semiconductor die including a number of bond pads. Each of the contacts is directly attached and bonded to one of the bond pads on the semiconductor die. Each of the contacts is situated over a top portion of one of the leads, where the top portion has a shorter length than a middle portion of each of the leads. Each of the contacts is connected to one of the bond pads on the semiconductor die without a wire bond. The semiconductor die does not include a redistribution layer situated over an active surface of the semiconductor die.