The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 05, 2012
Filed:
Mar. 06, 2007
Applicants:
Ken Jian Ming Wang, San Francisco, CA (US);
Ming Wang Sze, Ladera Ranch, CA (US);
Inventors:
Ken Jian Ming Wang, San Francisco, CA (US);
Ming Wang Sze, Ladera Ranch, CA (US);
Assignee:
Broadcom Corporation, Irvine, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/544 (2006.01);
U.S. Cl.
CPC ...
Abstract
According to one embodiment, a semiconductor die having increased usable area has at least six sides. The semiconductor die has a reduced stress at each corner of the die, resulting in smaller keep out zones near the corners of the semiconductor die, which allow the placement of bond pads near each corner of the die. The semiconductor die further allows the placement of active circuitry near each corner of the semiconductor die. One embodiment results in a 5.0% increase in usable area on the semiconductor die.