For the Inventor, By the Inventor

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Taichung, Taiwan

Siliconware Precision Industries Co., Ltd.

USPTO Granted Patents = 819

Forward Citations = 10,527

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557 inventors (with patents filed for the assignee):

Chien-Ping Huang (194 out of 196 patents)

Chang-Fu Lin (62 out of 62 patents)

Cheng-Hsu Hsiao (58 out of 58 patents)

4. Chih-Ming Huang (55 out of 55 patents)

5. Chih-Hsien Chiu (52 out of 52 patents)

6. Shih-Kuang Chiu (42 out of 42 patents)

7. Han-Ping Pu (41 out of 127 patents)

8. Chun-Chi Ke (41 out of 41 patents)

9. Chun-Tang Lin (35 out of 35 patents)

10. Yu-Po Wang (32 out of 34 patents)

11. Chien Ping Huang (32 out of 32 patents)

12. Chi-Chuan Wu (29 out of 29 patents)

13. Ho-Yi Tsai (26 out of 26 patents)

14. Chia-Chu Lai (25 out of 26 patents)

15. Chia-Yang Chen (24 out of 25 patents)

Core Competencies:

Electronic Package

Substrate Structure

Semiconductor Package

Thermal Conductive Materials

Antenna Module

Lead Frame

Carrier Structure

Heat Dissipation Structure

Electronic Structure

Conductive Layer

Fabrication Method

Wire Inside Electronic Component

819 patents: Sort by Forward Citations

1. 12494460 - Electronic package and manufacturing method thereof (2025-12-09),

2. 12476229 - Electronic package (2025-11-18),

3. 12469774 - Electronic package and substrate structure thereof (2025-11-11),

4. 12451416 - Electronic package and manufacturing method thereof (2025-10-21),

5. 12438266 - Electronic package and manufacturing method thereof, and antenna module and manufacturing method thereof (2025-10-07),

6. 12438094 - Electronic package and manufacturing method thereof (2025-10-07),

7. 12438079 - Electronic structure (2025-10-07),

8. 12417983 - Semiconductor package (2025-09-16),

9. 12414232 - Substrate structure (2025-09-09),

10. 12412869 - Electronic structure having first and second thermal conductive materials covering conductive bumps and manufacturing method thereof, and electronic package having electronic structure and manufacturing method thereof (2025-09-09),

11. 12412820 - Electronic package and manufacturing method thereof (2025-09-09),

12. 12412819 - Electronic package and manufacturing method thereof (2025-09-09),

13. 12400931 - Electronic package and manufacturing method thereof (2025-08-26),

14. 12394636 - Method for fabricating electronic package (2025-08-19),

15. 12388062 - Electronic package and manufacturing method thereof (2025-08-12),

Siliconware Precision Industries Co., Ltd. (SPIL) is a leading provider of semiconductor assembly and test services. With headquarters in Taiwan, SPIL offers a comprehensive range of packaging and testing solutions for integrated circuits (ICs). With over 30 years of experience in the industry, SPIL has earned a reputation for delivering high-quality products and services to customers worldwide. For more information about SPIL and its offerings, please visit their official website.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 9 2025

819 Patents

#3 in Taichung

#37 in Taiwan

#1,192 in the World

Taichung, Taiwan

Siliconware Precision Industries Co., Ltd.

Forward Citations = 10,527

557 inventors:

Chien-Ping Huang (194 out of 196 patents)

Chang-Fu Lin (62 out of 62 patents)

Cheng-Hsu Hsiao (58 out of 58 patents)

4. Chih-Ming Huang (55 out of 55 patents)

5. Chih-Hsien Chiu (52 out of 52 patents)

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