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Taichung, Taiwan

Siliconware Precision Industries Co., Ltd.

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USPTO Granted Patents = 826

% Expired Patents = 13.6

Forward Citations = 10,656

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564 inventors (with patents filed for the assignee):

Chien-Ping Huang (194 out of 196 patents)

Chang-Fu Lin (62 out of 62 patents)

Cheng-Hsu Hsiao (58 out of 58 patents)

4. Chih-Ming Huang (55 out of 55 patents)

5. Chih-Hsien Chiu (54 out of 57 patents)

6. Shih-Kuang Chiu (42 out of 42 patents)

7. Han-Ping Pu (41 out of 128 patents)

8. Chun-Chi Ke (41 out of 41 patents)

9. Chun-Tang Lin (35 out of 35 patents)

10. Yu-Po Wang (32 out of 34 patents)

11. Chien Ping Huang (32 out of 32 patents)

12. Chi-Chuan Wu (29 out of 29 patents)

13. Chia-Chu Lai (27 out of 28 patents)

14. Ho-Yi Tsai (26 out of 26 patents)

15. Chia-Yang Chen (25 out of 28 patents)

Core Competencies:

Electronic Package

Substrate Structure

Multi-Chip Package

Thermal Management

Carrier Structure

Conductive Bumps

Assembly Methods

Antenna Modules

Manufacturing Method

Chip Stacking

Wire Interconnections

826 patents: Sort by Forward Citations

1. 12526912 - Carrier structure (2026-01-13),

2. 12525524 - Electronic package (2026-01-13),

3. 12525505 - Electronic package of two vertically stacked chips with chip-to-chip bump connections and manufacturing method thereof (2026-01-13),

4. 12500181 - Electronic package and manufacturing method thereof (2025-12-16),

5. 12500159 - Electronic package having multi-chip package structure (2025-12-16),

6. 12500145 - Electronic package and manufacturing method thereof (2025-12-16),

7. 12500131 - Electronic package including an interposer stacked on an electronic element and manufacturing method thereof (2025-12-16),

8. 12494460 - Electronic package and manufacturing method thereof (2025-12-09),

9. 12476229 - Electronic package (2025-11-18),

10. 12469774 - Electronic package and substrate structure thereof (2025-11-11),

11. 12451416 - Electronic package and manufacturing method thereof (2025-10-21),

12. 12438266 - Electronic package and manufacturing method thereof, and antenna module and manufacturing method thereof (2025-10-07),

13. 12438094 - Electronic package and manufacturing method thereof (2025-10-07),

14. 12438079 - Electronic structure (2025-10-07),

15. 12417983 - Semiconductor package (2025-09-16),

Company Overview

Siliconware Precision Industries Co., Ltd. is a leading provider of electronic packaging solutions, specializing in advanced technologies that enhance the performance and reliability of semiconductor devices. The company focuses on various core technology topics, including electronic packages, substrate structures, multi-chip packages, and thermal management solutions. Based in Taichung, Taiwan, Siliconware is committed to innovation in assembly methods and conductive bumps, catering to the evolving needs of the electronics industry.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 27 2026

826 Patents

#3 in Taichung

#40 in Taiwan

#1,226 in the World

Taichung, Taiwan

Siliconware Precision Industries Co., Ltd.

Forward Citations = 10,656

564 inventors:

Chien-Ping Huang (194 out of 196 patents)

Chang-Fu Lin (62 out of 62 patents)

Cheng-Hsu Hsiao (58 out of 58 patents)

4. Chih-Ming Huang (55 out of 55 patents)

5. Chih-Hsien Chiu (54 out of 57 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Siliconware Precision Industries Co., Ltd.. Retrieved from https://idiyas.com/company/siliconware-precision-industries-company

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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