The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 16, 2025
Filed:
Dec. 08, 2022
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Shu-Ting Lai, Taichung, TW;
Chiu-Lien Li, Taichung, TW;
Che-Min Su, Taichung, TW;
Chun-Huan Hung, Taichung, TW;
Mu-Hung Hsieh, Taichung, TW;
Cheng-Han Yao, Taichung, TW;
Fajanilan Darcyjo Directo, Taichung, TW;
Cheng-Liang Hsu, Taichung, TW;
SILICONWARE PRECISION INDUSTRIES CO., LTD., Taichung, TW;
Abstract
A carrier structure is provided with a plurality of package substrates connected via connecting sections, and a functional element and a groove are formed on the connecting section, such that the groove is located between the package substrate and the functional element. Therefore, when a cladding layer covering a chip is formed on the package substrate, the groove can accommodate a glue material overflowing from the cladding layer to prevent the glue material from contaminating the functional element.