Chun-Huan Hung

Title: Innovations by Chun-Huan Hung in Semiconductor Packaging

Introduction

Chun-Huan Hung is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor packaging. His innovative approach has led to the development of a unique carrier structure that enhances the functionality and reliability of semiconductor devices.

Latest Patents

Chun-Huan Hung holds a patent for a semiconductor package. This invention features a carrier structure with multiple package substrates connected through connecting sections. A functional element and a groove are formed on the connecting section, allowing the groove to accommodate glue material that may overflow from a cladding layer. This design prevents contamination of the functional element, showcasing his ingenuity in addressing common challenges in semiconductor packaging.

Career Highlights

Chun-Huan Hung is associated with Siliconware Precision Industries Co., Ltd., a leading company in the semiconductor industry. His work has been instrumental in advancing packaging technologies that are crucial for modern electronic devices. With a focus on innovation, he continues to contribute to the field through his research and development efforts.

Collaborations

Chun-Huan Hung has collaborated with talented coworkers such as Shu-Ting Lai and Chiu-Lien Li. Their combined expertise fosters a creative environment that drives innovation in semiconductor technology.

Conclusion

Chun-Huan Hung's contributions to semiconductor packaging exemplify the importance of innovation in technology. His patent reflects a thoughtful approach to solving industry challenges, and his work continues to influence the field positively.