Chiu-Lien Li

Title: Innovations by Chiu-Lien Li in Semiconductor Packaging

Introduction

Chiu-Lien Li is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor packaging, showcasing his innovative spirit through his patented inventions. His work is particularly relevant in the ever-evolving technology landscape.

Latest Patents

Chiu-Lien Li holds a patent for a semiconductor package that features a unique carrier structure. This structure includes multiple package substrates connected by sections, with a functional element and a groove formed on the connecting section. The groove is strategically located between the package substrate and the functional element. This design allows for the accommodation of glue material that may overflow from a cladding layer, preventing contamination of the functional element. This innovation enhances the reliability and efficiency of semiconductor devices.

Career Highlights

Chiu-Lien Li is currently employed at Siliconware Precision Industries Co., Ltd., a leading company in the semiconductor industry. His role at the company allows him to apply his expertise in developing advanced packaging solutions. His contributions have been instrumental in improving the performance and durability of semiconductor products.

Collaborations

Chiu-Lien Li collaborates with talented professionals in his field, including Shu-Ting Lai and Che-Min Su. These collaborations foster a creative environment that encourages the exchange of ideas and the development of cutting-edge technologies.

Conclusion

Chiu-Lien Li's innovative work in semiconductor packaging exemplifies the importance of creativity and collaboration in technology. His patent reflects a significant advancement in the industry, contributing to the ongoing evolution of semiconductor devices.