The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 28, 2026
Filed:
Dec. 08, 2022
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Cheng-Liang Hsu, Taichung, TW;
Wan-Rou Chen, Taichung, TW;
Hsin-Yin Chang, Taichung, TW;
Tsung-Li Lin, Taichung, TW;
Hsiu-Jung Li, Taichung, TW;
Chiu-Lien Li, Taichung, TW;
Fu-Quan Xu, Taichung, TW;
Yi-Wen Liu, Taichung, TW;
Chih-Chieh Sun, Taichung, TW;
SILICONWARE PRECISION INDUSTRIES CO., LTD., Taichung, TW;
Abstract
A carrier structure is provided, in which at least one positioning area is defined on a chip-placement area of a package substrate, and at least one alignment portion is disposed on the positioning area. Therefore, the precision of manufacturing the alignment portion is improved by disposing the positioning area on the chip-placement area, such that the carrier structure can provide a better alignment mechanism for the chip placement operation.