Taichung, Taiwan

Wan-Rou Chen

This inventor holds 2 USPTO granted patents and 3 published patent applications. Top assignee: Siliconware Precision Industries, Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Wan-Rou Chen. Retrieved from https://idiyas.com/inventor/wan-rou-chen-l1osd01s

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 2 

% Patents Active = 100.0

Average Co-Inventor Count = 6.4

ph-index = 1


Company Filing History:


Years Active: 2026

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2 patents (USPTO):Explore Patents

Title: The Innovations of Wan-Rou Chen

Introduction: Wan-Rou Chen is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor packaging. His work focuses on improving the precision and efficiency of chip placement operations.

Latest Patents: Wan-Rou Chen holds a patent for a carrier structure. This innovative design includes at least one positioning area defined on a chip-placement area of a package substrate. Additionally, it features at least one alignment portion disposed on the positioning area. This arrangement enhances the precision of manufacturing the alignment portion, thereby providing a better alignment mechanism for chip placement operations. He has 1 patent to his name.

Career Highlights: Wan-Rou Chen is currently employed at Siliconware Precision Industries, Ltd. His role involves developing advanced packaging solutions that cater to the evolving needs of the semiconductor industry. His expertise has been instrumental in driving innovation within his company.

Collaborations: Wan-Rou Chen has worked alongside his coworker, Cheng-Liang Hsu, contributing to various projects that aim to enhance semiconductor technology.

Conclusion: Wan-Rou Chen's contributions to the field of semiconductor packaging demonstrate his commitment to innovation and precision. His patent for a carrier structure exemplifies his ability to address industry challenges effectively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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