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Siliconware Precision Industries, Ltd.

USPTO Granted Patents = 30

Forward Citations = 20

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106 inventors (with patents filed for the assignee):

Yi-Min Fu (4 out of 14 patents)

Wen-Jung Tsai (3 out of 25 patents)

Chih-Hsien Chiu (3 out of 57 patents)

4. Yu-PO Wang (3 out of 4 patents)

5. Wei-Son Tsai (3 out of 3 patents)

6. Chi-Ching Ho (2 out of 20 patents)

7. Chia-Yang Chen (2 out of 28 patents)

8. Chien-Cheng Lin (2 out of 28 patents)

9. Tsung-Li Lin (2 out of 5 patents)

10. Yih-Jenn Jiang (2 out of 12 patents)

11. Hsiu-Jung Li (2 out of 4 patents)

12. Ko-Wei Chang (2 out of 12 patents)

13. Hsin-Yin Chang (2 out of 3 patents)

14. Yi-Wen Liu (2 out of 2 patents)

15. Kun-Yuan Luo (2 out of 2 patents)

Core Competencies:

Heat Dissipation

Substrate Structure

Semiconductor Integration

Packaging Method

Electrical Detection

Bonding Status Detection

Chip Groundability

Fabricating Method

Ultrasonic Device

Test Base Cleaning

Carrier Structure

30 patents: Sort by Forward Citations

1. 12745630 - Electronic package with improved heat dissipating and manufacturing method thereof (2026-09-22),

2. 12740407 - Electronic package and manufacturing method thereof (2026-09-15),

3. 12733548 - Electronic package and fabricating method thereof (2026-09-08),

4. 12733504 - Electronic package and manufacturing method thereof (2026-09-08),

5. 12686039 - Test base cleaning line and method thereof (2026-07-21),

6. 12685211 - Electronic package and manufacturing method thereof (2026-07-14),

7. 12685173 - Electronic package and shielding part including semiconductor block and magnetized layer (2026-07-14),

8. 12685155 - Electronic package and substrate structure thereof (2026-07-14),

9. 12672553 - Electronic package having a chip with a trench in the surface (2026-06-30),

10. 12672547 - Electronic package and manufacturing method thereof (2026-06-30),

11. 12666986 - Electronic package and manufacturing method thereof (2026-06-23),

12. 12650567 - Electronic package and manufacturing method thereof (2026-06-09),

13. 12648446 - Electronic package and manufacturing method thereof (2026-06-02),

14. 12646826 - Electronic package and manufacturing method thereof (2026-06-02),

15. 12642114 - Electronic package and circuit structure thereof (2026-05-26),

Siliconware Precision Industries, Ltd. is a leading provider of semiconductor packaging and testing services. The company specializes in advanced packaging technologies, including system-in-package (SiP) and flip chip solutions, catering to a diverse range of applications in the electronics industry. With a strong focus on innovation, Siliconware is committed to enhancing the performance and reliability of semiconductor devices. Headquartered in Taiwan, the company plays a pivotal role in the global semiconductor supply chain.

Profile summary based on public USPTO records.

Company Badge

USPTO Data Jan 1 1976 - Sep 29 2026

30 Patents

#6 in

#586 in Taiwan

#21,840 in the World

Siliconware Precision Industries, Ltd.

Forward Citations = 20

106 inventors:

Yi-Min Fu (4 out of 14 patents)

Wen-Jung Tsai (3 out of 25 patents)

Chih-Hsien Chiu (3 out of 57 patents)

4. Yu-PO Wang (3 out of 4 patents)

5. Wei-Son Tsai (3 out of 3 patents)

Please report any incorrect information to [email protected]

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