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Siliconware Precision Industries, Ltd.

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USPTO Granted Patents = 34

Forward Citations = 21

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109 inventors (with patents filed for the assignee):

Yi-Min Fu (4 out of 14 patents)

Yu-PO Wang (4 out of 5 patents)

Wen-Jung Tsai (3 out of 25 patents)

4. Chih-Hsien Chiu (3 out of 57 patents)

5. Wei-Son Tsai (3 out of 3 patents)

6. Shuai-Lin Liu (3 out of 3 patents)

7. Nai-Hao Kao (3 out of 3 patents)

8. Yu-Lung Huang (2 out of 18 patents)

9. Chi-Ching Ho (2 out of 20 patents)

10. Chia-Yang Chen (2 out of 28 patents)

11. Chien-Cheng Lin (2 out of 28 patents)

12. Tsung-Li Lin (2 out of 5 patents)

13. Yih-Jenn Jiang (2 out of 12 patents)

14. Hsiu-Jung Li (2 out of 4 patents)

15. Ko-Wei Chang (2 out of 12 patents)

Core Competencies:

Heat Dissipation

Substrate Structure

Semiconductor Integration

Packaging Method

Electrical Detection

Bonding Status Detection

Chip Groundability

Fabricating Method

Ultrasonic Device

Test Base Cleaning

Carrier Structure

34 patents: Sort by Forward Citations

1. 12794124 - Antenna substrate and electronic device (2026-11-10),

2. 12787826 - Electronic package and manufacturing method thereof (2026-11-03),

3. 12787764 - Electronic package and manufacturing method thereof (2026-11-03),

4. 12765381 - Electronic package and manufacturing method thereof (2026-10-13),

5. 12745630 - Electronic package with improved heat dissipating and manufacturing method thereof (2026-09-22),

6. 12740407 - Electronic package and manufacturing method thereof (2026-09-15),

7. 12733548 - Electronic package and fabricating method thereof (2026-09-08),

8. 12733504 - Electronic package and manufacturing method thereof (2026-09-08),

9. 12686039 - Test base cleaning line and method thereof (2026-07-21),

10. 12685211 - Electronic package and manufacturing method thereof (2026-07-14),

11. 12685173 - Electronic package and shielding part including semiconductor block and magnetized layer (2026-07-14),

12. 12685155 - Electronic package and substrate structure thereof (2026-07-14),

13. 12672553 - Electronic package having a chip with a trench in the surface (2026-06-30),

14. 12672547 - Electronic package and manufacturing method thereof (2026-06-30),

15. 12666986 - Electronic package and manufacturing method thereof (2026-06-23),

Company Overview

Siliconware Precision Industries, Ltd. is a leading provider of semiconductor packaging and testing services. The company specializes in advanced packaging technologies, including system-in-package (SiP) and flip chip solutions, catering to a diverse range of applications in the electronics industry. With a strong focus on innovation, Siliconware is committed to enhancing the performance and reliability of semiconductor devices. Headquartered in Taiwan, the company plays a pivotal role in the global semiconductor supply chain.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Nov 10 2026

34 Patents

#6 in

#537 in Taiwan

#19,697 in the World

Siliconware Precision Industries, Ltd.

Forward Citations = 21

109 inventors:

Yi-Min Fu (4 out of 14 patents)

Yu-PO Wang (4 out of 5 patents)

Wen-Jung Tsai (3 out of 25 patents)

4. Chih-Hsien Chiu (3 out of 57 patents)

5. Wei-Son Tsai (3 out of 3 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Siliconware Precision Industries, Ltd.. Retrieved from https://idiyas.com/company/siliconware-precision-industries

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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