For the Inventor, By the Inventor

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Siliconware Precision Industries, Ltd.

USPTO Granted Patents = 3

Forward Citations = 20

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7 inventors (with patents filed for the assignee):

Chien-Ping Huang (1 out of 196 patents)

Chin Fa Wang (1 out of 1 patent)

Wen-Ta Tsai (1 out of 9 patents)

4. Yuan-Ping Joe (1 out of 1 patent)

5. Lee Ming-Hsun (1 out of 1 patent)

6. Chen Chin-Te (1 out of 1 patent)

7. Jui-Meng Jao (1 out of 6 patents)

3 patents: Sort by Forward Citations

1. 6903441 - Semiconductor package with enhanced chip groundability and method of fabricating the same (2005-06-07),

2. 6492828 - System and method for detecting bonding status of bonding wire of semiconductor package (2002-12-10),

3. 6249433 - Heat-dissipating device for integrated circuit package (2001-06-19),

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USPTO Data Jan 1 1976 - Dec 16 2025

3 Patents

#100 in

#3,189 in Taiwan

Siliconware Precision Industries, Ltd.

Forward Citations = 20

7 inventors:

Chien-Ping Huang (1 out of 196 patents)

Chin Fa Wang (1 out of 1 patent)

Wen-Ta Tsai (1 out of 9 patents)

4. Yuan-Ping Joe (1 out of 1 patent)

5. Lee Ming-Hsun (1 out of 1 patent)

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